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Tax Registration Number: 91440101552358350G

Bank:BANK OF CHINA GUANGZHOU ZENGCHENG ZHONGXIN SUB-BR

Account :705569418477

E-mail: gdyshg@163.com

Tel: 15118868698 020-87471488

Business address:The new town of Zengcheng District of Guangzhou Ctiy in Cunjing Fung pui road 30

Tin stripping liquid,Tin stripping solution for metal surface,Tin remove liquid£¬Environment-friendly tin stripping agent

Product Name£ºTin stripping liquid,Tin stripping solution for metal surface,Tin remove liquid£¬Environment-friendly tin stripping agent

Price£º



Tin stripping liquid,Tin stripping solution for metal surface,Tin remove liquid£¬Environment-friendly tin stripping agent


Tin stripping liquid,Tin stripping solution for metal surface,Tin remove liquid£¬Environment-friendly tin stripping agent



First, product number£ºQ/YS.401-2


Second, application£º

This product is suitable for removal of tin and nickel on the surface of IC circuit board and the like. The speed of removal is fast and harmless to bottom material.


Third, product index£º

1.Performance light yellow transparent liquid, no uncomfortable smell.

2.PH value©‚5

3.Proportion£º©ƒ1.08


Fourth, usage method£º

1.This product use original solution at room temperature, tin temperature is less than 45¡æ.

2.The work piece is soaked in retreat tin liquid (¢ò) and flipped from time to time, take out the work piece when the Tin and nickel is removed.

3.Wash and do other processing.


Fifth, matters needing attention£º

1.Retreat tin liquid is packed in plastic or stainless steel (# 304) container.

2.The amount of the work piece to be added is not too much, to prevent heating up quickly and damage the work piece.

3.You can add 1%-1.5% of nickel accelerator for the work piece £¬whose nickel layer is too thick.


Other processing£ºChemical Plating Liquid Train¡¢Chemical silver plating liquid (copper substrate)¡¢Stainless steel chemical thicker liquid copper  plating¡¢Tin surface treatment agent series¡¢Copper oil removal passivation agent¡¢Tin stripping liquid(copper substrate)